Rugged 1U GEN10 DL360RS

The rugged DL360RS GEN10 1U standard depth rugged server is based on the HPE industry leading DL360 Server platform.

Core Systems DL360RS Gen10 1U Standard Depth Rugged Server

Does your data center need a secure, performance driven rugged server that you can confidently deploy for virtualization, database, or high-performance computing? The powerful DL360RS GEN10 1U Rugged Short Depth Server is redefining dense compute by delivering security, agility and unmatched expandability for a variety of military environments. All of this with the best memory and I/O expandability—packed in a rugged 1U/2-socket rackmount design.

The DL360RS GEN10 1U Rugged Short Depth Server supports the Intel^® Xeon^® Processor Scalable Family with up to 28 cores, plus 2666 MT/s HPE DDR4 SmartMemory supporting up to 3.0 TB max. With the added performance that 12 NVDIMMs and 10 NVMe brings, the DL360RS GEN10 1U Rugged Short Depth Server means business. Deploy this dense platform for diverse workloads in space constrained environments and maintain it with ease by automating the most essential server lifecycle management tasks with HPE OneView and HPE iLO 5.

You can manage your DL360RS in any tactical IT environment by automating the most essential server lifecycle management tasks—deploy, update, monitor, and maintain. To support your heterogeneous tactical IT environment, the DL360RS supports Microsoft^® Windows^® and Linux^® operating systems, as well as VMware^® and Citrix^® virtualization environments.

1.70" Height
27.50" Depth
17.75" Width
27-34 lbs Weight

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Technical Specifications

Environmental Specifications:	Operational Temperature Range: MIL-STD-810F/G, Method 501.5, Procedures I/II; -10C to +50C with solid state drives Storage: MIL-STD-810F/G, Method 501.5, Procedures I/II; -40C to +75C Humidity: MIL-STD-810F/G, Method 507.4; 48 hour, 95% RH 40-65C with humidity option Altitude: MIL-STD-810F/G, Method 500.4; 12,500ft operation with 40,000ft transport Vibration: MIL-STD-810F/G, Method 514.6 Procedure I; 4.43 GRMS, 5-20000Hz, 60min/axis with solid state drives Shock: MIL-STD-810F/G, Method 516.6, Procedures I/V; 20g, 11msec functional shock; 40g 11msec crash hazard shock Other: MIL-STD-461F/G CE102 & RE102; Meets using CORESYSTEMS optional 461 EMI Kit
Mechanical:	Height - 1.70 in (4.32 cm), Width - 17.75 in (45.08 cm), Depth - 27.50 in (69.85 cm), Weight - 27-34 lbs (12.2-15.42 kg)
Compute:	Up to (2) Intel® Xeon® Processor Scalable Family up to 28 cores PCIe 3.0, up to three (3) available slot(s) + M.2 on riser
Memory:	HPE Smart Memory (24) DDR4 6 channels per CPU, up to 2666 MT/s (3.0 TB max1)
Persistant Memory:	Up to 192 GB Capacity - (12) 16 GB (2666 MT/s) NVDIMMs
Storage Options:	10 NVMe + 1 SFF/8+2+1 SFF/4 LFF + 1 SFF SAS/SATA HDD/SSD Plus M.2 SATA/PCIe and Dual uFF enablement kits
Network:	4x1GbE embedded + Choice of FlexibleLOM or Standup cards
DP/VGA/Serial/USB/SD:	Front Display Port Option, Rear VGA & Optional Serial, 3 USB 3.0, Dual MicroSD
Power Supplies:	Up to 96% eff. (Titanium) w/Flexible Slot FF and Battery back up Hot Plug Redundant fans with optional High-Performance fans

Environmental Specifications:
Operational Temperature Range: MIL-STD-810F/G, Method 501.5, Procedures I/II; -10C to +50C with solid state drives Storage: MIL-STD-810F/G, Method 501.5, Procedures I/II; -40C to +75C Humidity: MIL-STD-810F/G, Method 507.4; 48 hour, 95% RH 40-65C with humidity option Altitude: MIL-STD-810F/G, Method 500.4; 12,500ft operation with 40,000ft transport Vibration: MIL-STD-810F/G, Method 514.6 Procedure I; 4.43 GRMS, 5-20000Hz, 60min/axis with solid state drives Shock: MIL-STD-810F/G, Method 516.6, Procedures I/V; 20g, 11msec functional shock; 40g 11msec crash hazard shock Other: MIL-STD-461F/G CE102 & RE102; Meets using CORESYSTEMS optional 461 EMI Kit
Mechanical:
Height - 1.70 in (4.32 cm), Width - 17.75 in (45.08 cm), Depth - 27.50 in (69.85 cm), Weight - 27-34 lbs (12.2-15.42 kg)
Compute:
Up to (2) Intel® Xeon® Processor Scalable Family up to 28 cores PCIe 3.0, up to three (3) available slot(s) + M.2 on riser
Memory:
HPE Smart Memory (24) DDR4 6 channels per CPU, up to 2666 MT/s (3.0 TB max1)
Persistant Memory:
Up to 192 GB Capacity - (12) 16 GB (2666 MT/s) NVDIMMs
Storage Options:
10 NVMe + 1 SFF/8+2+1 SFF/4 LFF + 1 SFF SAS/SATA HDD/SSD Plus M.2 SATA/PCIe and Dual uFF enablement kits
Network:
4x1GbE embedded + Choice of FlexibleLOM or Standup cards
DP/VGA/Serial/USB/SD:
Front Display Port Option, Rear VGA & Optional Serial, 3 USB 3.0, Dual MicroSD
Power Supplies:
Up to 96% eff. (Titanium) w/Flexible Slot FF and Battery back up Hot Plug Redundant fans with optional High-Performance fans

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