| Height |
3.5 in |
| Width |
8.5 in |
| Depth |
14.75 in |
| Weight |
13 lbs |
| Power |
28VDC |
| RAM |
Up to 2TB per Node |
| Processor |
32x Intel® Xeon® Scalable Cores |
| Storage |
4x NVME Hot-Swap SSD Drives |
| Network |
2x 10G onboard NIC Ports; 1x 4-Port 10G NIC Card |
| Graphics |
(Optional) NVIDIA GPU Card |
| Security |
TPM 2.0 Module |
| Environmental Specifications |
Tested to meet military environmental specifications. |
| Operational Temperature |
MIL-STD-810F, Method 501.5 Procedure I; -15°C to +55°C |
| Storage Temperature |
MIL-STD-810F, Method 501.5 Procedure II; -55°C to +85°C |
| Humidity |
MIL-STD-810F, Method 507.4; 48 Hour, 95% RH 40-65C (with conformal coat option) |
| Altitude |
MIL-STD-810F, Method 500.4; 12,500ft operation with 40,000ft transport |
| Vibration |
MIL-STD-810G, Method 514.6 Procedure I; 4.43 GRMS, 5-20000Hz, 60min/axis |
| Shock |
MIL-STD-810G, Method 516.6, Procedures I/V; 20g, 11msec - functional shock; 40g, 11msec crash hazard shock |
| Other |
MIL-STD-461F CE & RE emissions (with 461 filter option) |