Environmental Specifications:

Operational Temperature Range: MIL-STD-810F/G, Method 501.5, Procedures I/II; -10C to +50C with solid state drives

Storage: MIL-STD-810F/G, Method 501.5, Procedures I/II; -40C to +75C

Humidity: MIL-STD-810F/G, Method 507.4; 48 hour, 95% RH 40-65C with humidity option

Altitude: MIL-STD-810F/G, Method 500.4; 12,500ft operation with 40,000ft transport

Vibration: MIL-STD-810F/G, Method 514.6 Procedure I; 4.43 GRMS, 5-20000Hzz, 60min/axis with solid state drives

Shock: MIL-STD-810F/G, Method 516.6, Procedures I/V; 20g, 11msec functional shock; 40g 11msec crash hazard shock

Other: MIL-STD-461F/G CE102 & RE102; Meets using CORESYSTEMS optional 461 EMI Kit

Mechanical:

Height - 3.50 in (8.89 cm), Width - 17.75 in (45.08 cm), Depth - 20.00 in (50.8 cm), Weight - 30-35 lbs (13.6-15.8 kg)

CPU:

Intel® CPU architecture options from Intel embedded long-life roadmap; Vapor chamber technology heatsinks; Intel E5-2600v4 Series CPUs; Dual 10-Core or dual 12-Core CPU options

Expansion Slots:

Three (3) full-height, 3/4 length slots; multiple PCIe slot combinations are available

External Bays:

Option 1- (std) Four (4) removable hot swap SATA or SAS 2.5 or 3.5 HDDs; Option 2- Four (4) removable hot swap 2.5 SATA SSD HDDs; Option 3- (offered along with option 1 or 2) One (1) slim line CD/DVD (R/W) or Blu-ray ODD

Cooling:

80mm high speed, high volume fans (3 center mount); Thermostatically controlled via motherboard

Power Supply Options:

Option 1- (std) 120/240VAC w/PFC 2U redundant power supply; Option 2- 120/240VAC w/PFC 2U power supply; Option 3- 24VDC 2U power supply; Option 4- 24VDC 2U redundant power supply

System Board:

X9DR3-F, Socket 2011, 512GB ECC Reg. DDR3, PS/2 KB/M, DB9 Serial, VGA, 4-USB, 2-GBLAN, On-board SAS, IPMI w/ KVM over IP